Las cookies nos ayudan a ofrecer nuestros servicios. Al utilizar nuestros servicios, aceptas el uso de cookies.
De En Es
Kundenservice: +49 (0) 551 - 547 24 0

Editorial Cuvillier

Publicaciones, tesis doctorales, capacitaciónes para acceder a una cátedra de universidad & prospectos.
Su editorial internacional especializado en ciencias y economia

Editorial Cuvillier

Analysis of the Hole Shape Evolution in Ultrashort Pulse Laser Drilling

EUR 30,70

EUR 21,49

Analysis of the Hole Shape Evolution in Ultrashort Pulse Laser Drilling (Tienda española)

Sven Döring (Autor)


Indice, PDF (50 KB)
Lectura de prueba, PDF (150 KB)

ISBN-13 (Impresion) 9783954048670
ISBN-13 (E-Book) 9783736948679
Idioma Inglés
Numero de paginas 154
Laminacion de la cubierta mate
Edicion 1. Aufl.
Lugar de publicacion Göttingen
Lugar de la disertacion Jena
Fecha de publicacion 25.11.2014
Clasificacion simple Tesis doctoral
Area Física
Palabras claves Physics, Optics, Laser, Material Processing, Laser Drilling, Physik, Optik, Materialbearbeitung, Laserbohren

Ultrashort laser pulses are capable of generating micro structures with high precision and challenging quality for electronics, optics, medical and automotive applications. However, the realization of microstructures with high aspect-ratio, especially microdrillings, is still a demanding task. Deep drillings show the formation of bulges, a bending of the hole and multiple capillaries. A direct investigation of the drilling process in opaque materials, especially metals, is not feasible and different explanations for the hole shape formation have been developed. The specific contribution of the possible influences on the shape formation are not fully understood yet.

In this work, an in-situ observation of drilling in an opaque material is realized for the first time. Silicon is used as a model system for laser drilling in semiconductors and metals. The influence of the processing parameters on the hole shape evolution is studied in detail, in particular for the pulse energy, pulse duration, repetition rate as well as ambient pressure. The reasons for the special drilling behavior are examined with focus on the particle deposition, the plasma interaction and the light propagation inside the hole capillary.