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Development of Sub-mm Wave Flip-Chip Interconnect (Volumen 38) (Tienda española)
Sirinpa Monayakul (Autor)Previo
Lectura de prueba, PDF (280 KB)
Indice, PDF (45 KB)
| ISBN-13 (Impresion) | 9783736994102 |
| ISBN-13 (E-Book) | 9783736984103 |
| Idioma | Inglés |
| Numero de paginas | 146 |
| Edicion | 1. Aufl. |
| Serie | Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik |
| Volumen | 38 |
| Lugar de publicacion | Göttingen |
| Lugar de la disertacion | Berlin |
| Fecha de publicacion | 13.12.2016 |
| Clasificacion simple | Tesis doctoral |
| Area |
Ingeniería eléctrica
Telecomunicaciones e ingeniería de comunicaciones |
| Palabras claves | High-Frequency Applications, Process Technology, Sub-mm Wave Flip-Chip Interconnect |
Descripcion
With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz.
Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.
