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Development of Sub-mm Wave Flip-Chip Interconnect

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Development of Sub-mm Wave Flip-Chip Interconnect (Volumen 38)

Sirinpa Monayakul (Autor)

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Lectura de prueba, PDF (280 KB)
Indice, PDF (45 KB)

ISBN-13 (Impresion) 9783736994102
ISBN-13 (E-Book) 9783736984103
Idioma Inglés
Numero de paginas 146
Edicion 1. Aufl.
Serie Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik
Volumen 38
Lugar de publicacion Göttingen
Lugar de la disertacion Berlin
Fecha de publicacion 13.12.2016
Clasificacion simple Tesis doctoral
Area Ingeniería eléctrica
Telecomunicaciones e ingeniería de comunicaciones
Palabras claves High-Frequency Applications, Process Technology, Sub-mm Wave Flip-Chip Interconnect
Descripcion

With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz.
Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.