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Development of Sub-mm Wave Flip-Chip Interconnect (Volume 38) (English shop)
Sirinpa Monayakul (Author)Preview
Extract, PDF (280 KB)
Table of Contents, PDF (45 KB)
| ISBN-13 (Hard Copy) | 9783736994102 |
| ISBN-13 (eBook) | 9783736984103 |
| Language | English |
| Page Number | 146 |
| Edition | 1. Aufl. |
| Book Series | Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik |
| Volume | 38 |
| Publication Place | Göttingen |
| Place of Dissertation | Berlin |
| Publication Date | 2016-12-13 |
| General Categorization | Dissertation |
| Departments |
Electrical engineering
Telecommunications and communications engineering |
| Keywords | High-Frequency Applications, Process Technology, Sub-mm Wave Flip-Chip Interconnect |
Description
With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz.
Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.
