|Book Series (78)||
|Mechanical and process engineering||765|
|Mining and metallurgy||29|
|Architecture and civil engineering||63|
5. Auflage bestellen
|ISBN-13 (Hard Copy)||9783736994102|
|Book Series||Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik|
|Place of Dissertation||Berlin|
Telecommunications and communications engineering
|Keywords||High-Frequency Applications, Process Technology, Sub-mm Wave Flip-Chip Interconnect|
With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz.
Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.