Systematische Mehrlagen-Integration hybrider Hochfrequenzschaltungen (English shop)

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Electronic circuits are the basis of modern communication, whose operating frequency is continually rising in line with growing demands. In order to provide a foundation for high-quality assemblies in the future as well, the technology must be continuously developed further. The ceramic multilayer technology LTCC has gained increasing importance over the past two decades. It promises high flexibility at low initial costs and has been successfully employed for the miniaturisation of communication systems at frequencies of a few gigahertz. One key to reducing dimensions and enhancing performance is the integration of passive structures into the ceramic substrate material. In order to make LTCC, a technology that has been successfully employed to date, usable at much higher frequencies as well, this work addresses three core issues.