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Cuvillier Verlag

Publications, Dissertations, Habilitations & Brochures.
International Specialist Publishing House for Science and Economy

Cuvillier Verlag

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Interconnect Technology for Three-Dimensional Chip Integration

Andreas Munding – Author profile

Contributed to the following publications

Interconnect Technology for Three-Dimensional Chip Integration
Interconnect Technology for Three-Dimensional Chip Integration
Andreas Munding
Author
ISBN-13 (Hard Copy): 978-3-86727-406-7
ISBN-13 (eBook): 978-3-73692-406-2
Price_print
EUR 16.00 EUR 15.20
Price_ebook
EUR 11.20
2007-10-30

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