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Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading

Mohammad Hossein Shirangi – Author profile

Contributed to the following publications
Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading
Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading (Volume 4)
Mohammad Hossein Shirangi
Author
ISBN-13 (Hard Copy): 978-3-86955-433-4
ISBN-13 (eBook): 978-3-73693-433-7
Price_print
EUR 30.30 EUR 28.79
Price_ebook
EUR 0.00
2010-08-09
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