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Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading

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Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading (Volume 4) (English shop)

Mohammad Hossein Shirangi (Author)

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ISBN-13 (Printausgabe) 3869554339
ISBN-13 (Hard Copy) 9783869554334
ISBN-13 (eBook) 9783736934337
Language English
Page Number 192
Edition 1 Aufl.
Book Series Schriftenreihe des Lehrstuhls für Kontinuumsmechanik und Materialtheorie der Technischen Universität Berlin
Volume 4
Publication Place Göttingen
Place of Dissertation TU Berlin
Publication Date 2010-08-09
General Categorization Dissertation
Departments Mechanical and process engineering
Keywords electronic-packaging