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Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading (Volume 4) (English shop)
Mohammad Hossein Shirangi (Author)Preview
Table of Contents, Datei (51 KB)
Extract, Datei (170 KB)
| ISBN-13 (Printausgabe) | 3869554339 |
| ISBN-13 (Hard Copy) | 9783869554334 |
| ISBN-13 (eBook) | 9783736934337 |
| Final Book Format | A5 |
| Language | English |
| Page Number | 192 |
| Edition | 1 Aufl. |
| Book Series | Schriftenreihe des Lehrstuhls für Kontinuumsmechanik und Materialtheorie der Technischen Universität Berlin |
| Volume | 4 |
| Publication Place | Göttingen |
| Place of Dissertation | TU Berlin |
| Publication Date | 2010-08-09 |
| General Categorization | Dissertation |
| Departments |
Mechanical and process engineering
|
| Keywords | electronic-packaging |
